CDM L Series Modular Data Center
Engineered for ultra-high-density AI and HPC workloads
Purpose-built for high-density AI and HPC workloads, The CDM L Series is a scalable, customizable modular data center designed in the USA. Engineered to support 50–250+ kW per rack and scalable up to 3+ MW per instance, it’s the perfect solution for hyperscalers and AI operators seeking performance, flexibility, and speed to deployment.
Key Benefits
High-Density Performance: Supports next-gen AI/ML training in a dual-module configurations.
Advanced Cooling Architecture: Air and liquid cooling options including direct-to-chip and overhead AHU.
Flexible Power Distribution: N or N+1 configurations tailored to your application.
Open OEM Integration: Compatible with all leading OEM chip and hardware providers
Rapid Deployment: Factory-integrated and tested for 30–50% faster deployment.
Resilient & Compliant: UL2755, NEMA rated, Seismic C, wind/snow load ready.
Future-Ready Infrastructure: Modular design evolves with your IT needs.
Our base models allow clients to customize certain features/functionality based on application or hardware preference, without vendor lock in. CDM L Series Modular Data Center is purpose built in the USA and optimized for ultra-high density AI workloads, inspected, then shipped and assembled on site for faster ROI. CDM ensures customers have the right solution for their application without compromise.
| Features | CDM L Series |
|---|---|
| Dimensions (approx.): |
IT Module: 45' L, 11' W, 12' H Utility Module: 45' L, 11' W, 12' H Overhead Cooling Module: 45' L, 11' W, 4' H |
| Density: | Engineered for 50–250+ kW per rack |
| Capacity: | Scalable to 1.5–3 MW |
| Cooling: |
Direct-to-chip liquid Overhead AHU Hybrid air/liquid Under floor dual loop piping for liquid cooling Supports multiple CDU/cold plate cooling solutions Supports chilled water air cooling at 600kW max. |
| Power: |
Flexible busways Optional power cable support 480V/415V standard, 208V optional |
| Configuration: | Dual Module (IT and Utility) configuration with overhead cooling module |
| Weight | Utility Module 70,000 lbs, IT Module 60,000 lbs., Top Hat AHU: 15,000 lbs., 8-point bottom lift. |
| Deployment Speed: | 30–50% faster than traditional stick-built data centers. |
| Compliance: | UL2755 compliance, NEMA rated, meets Seismic C; sustains wind speeds up to 120 mph; snow loads up to 30 PSF; can be configured for higher environmental requirements. |
| OEM Compatibility | Supports multiple chip, IT hardware and infrastructure OEM equipment with no vendor lock‑in, allowing customers to determine best technology for their application. |
| Reliability | Supports Tier 1–4 architectures for uptime and redundancy |
| Lifecycle Services | Conceptualization and design, Industrial fabrication, Factory acceptance testing (FAT), Deployment and commissioning, Long-term maintenance and SLAs. |
Vendor-Neutral Expertise, Backed by Strong OEM Partnerships.
CDM takes a vendor-neutral approach, ensuring every solution is tailored to customer requirements rather than tied to a single manufacturer. We maintain strong partnerships with all major OEMs and keep factory-trained, certified technicians on staff to guarantee systems are designed, built, installed, integrated, and maintained to the highest standards. Beyond deployment, our team provides full Day 2 operations support and 24x7 emergency response, giving customers confidence that their modular solutions will perform reliably long after go-live.
Why Compu Dynamics Modular (CDM)
CDM delivers factory-tested modular data centers designed and built (in the USA to handle today’s high-density power and liquid cooling demands—and scale seamlessly as workloads grow. With more than 20 years of mission-critical expertise, we manage the full lifecycle from design to operations, reducing risk and accelerating deployment.
